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? 2001 microchip technology inc. ds21223e-page 1 m 25aa640/25lc640 device selection table features ? low power cmos technology - write current: 3 ma typical - read current: 500 a typical - standby current: 500 na typical 8192 x 8 bit organization 32 byte page write cycle time: 5 ms max. self-timed erase and write cycles block write protection - protect none, 1/4, 1/2 or all of array built-in write protection - power on/off data protection circuitry - write enable latch - write protect pin sequential read high reliability - data retention: > 200 years - esd protection: > 4000v 8-pin pdip, soic and tssop packages temperature ranges supported: - industrial (i): -40 c to +85 c - automotive (e): -40 c to +125 c description the microchip technology inc. 25aa640/25lc640 (25xx640 * ) is a 64k bit serial electrically erasable prom [eeprom]. the memory is accessed via a sim- ple serial peripheral interface (spi) compatible serial bus. the bus signals required are a clock input (sck) plus separate data in (si) and data out (so) lines. access to the device is controlled through a chip select (cs ) input. communication to the device can be paused via the hold pin (hold ). while the device is paused, transi- tions on its inputs will be ignored, with the exception of chip select, allowing the host to service higher priority interrupts. block diagram package types part number v cc range max clock frequency temp ranges 25aa640 1.8-5.5v 1 mhz i 25lc640 2.5-5.5v 2 mhz i 25lc640 4.5-5.5v 3/2.5 mhz i, e si so sck cs hold wp status register i/o control memory control logic x dec hv generator eeprom array page latches y decoder sense amp. r/w control logic v cc v ss 25xx640 25xx640 pdip/soic tssop cs so wp v ss v cc hold sck si 8 7 6 5 1 2 3 4 8 7 6 5 1 2 3 4 hold v cc cs so sck si v ss wp 64k spi? bus serial eeprom *25xx640 is used in this document as a generic part number for the 25aa640/25lc640 devices.
25aa640/25lc640 ds21223e-page 2 ? 2001 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings? v cc ............................................................................................................................... ..............................................7.0v all inputs and outputs w.r.t. v ss .......................................................................................................... -0.6v to v cc +1.0v storage temperature ............................................................................................................ ..................... -65 c to 150 c ambient temperature under bias ................................................................................................. ..............-65 c to 125 c soldering temperature of leads (10 seconds) .................................................................................... ...................+300 c esd protection on all pins ..................................................................................................... .....................................4 kv ? notice: stresses above those listed under ? maximum ratings ? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for an extended period of time may affect device reliability.
? 2001 microchip technology inc. ds21223e-page 3 25aa640/25lc640 1.1 dc characteristics dc characteristics industrial (i): t amb = -40 c to +85 c v cc = 1.8v to 5.5v automotive (e): t amb = -40 c to +125 c v cc = 4.5v to 5.5v param. no. sym characteristics min max units conditions d1 v ih 1 high level input voltage 2.0 v cc +1 v v cc 2.7v ( note ) d2 v ih 20.7 v cc v cc +1 v v cc < 2.7v ( note ) d3 v il 1 low level input voltage -0.3 0.8 v v cc 2.7v ( note ) d4 v il 2-0.30.2 v cc vv cc < 2.7v ( note ) d5 v ol low level output voltage ? 0.4 v i ol = 2.1 ma ? 0.2 v i ol = 1.0 ma, v cc = < 2.5v d6 v oh high level output voltage v cc -0.5 ? vi oh = -400 a d7 i li input leakage current -10 10 acs = v cc , v in = v ss to v cc d8 i lo output leakage current -10 10 acs = v cc , v out = v ss to v cc d9 c int internal capacitance (all inputs and outputs) ? 7pft amb = 25 c, clk = 1.0 mhz, v cc = 5.0v ( note ) d10 i cc read operating current ? ? 1 500 ma a v cc = 5.5v; f clk = 3.0 mhz; so = open v cc = 2.5v; f clk = 2.0 mhz; so = open d11 i cc write ? ? 5 3 ma ma v cc = 5.5v v cc = 2.5v d12 i ccs standby current ? ? 5 1 a a cs = v cc = 5.5v, inputs tied to v cc or v ss cs = v cc = 2.5v, inputs tied to v cc or v ss note: this parameter is periodically sampled and not 100% tested.
25aa640/25lc640 ds21223e-page 4 ? 2001 microchip technology inc. 1.2 ac characteristics ac characteristics industrial (i): t amb = -40 c to +85 cv cc = 1.8v to 5.5v automotive (e): t amb = -40 c to +125 cv cc = 4.5v to 5.5v param. no. sym characteristic min max units conditions 1f clk clock frequency ? ? ? 3 2 1 mhz mhz mhz v cc = 4.5v to 5.5v (note 2) v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 2t css cs setup time 100 250 500 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 3t csh cs hold time 150 250 475 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 4t csd cs disable time 500 ? ns 5t su data setup time 30 50 50 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 6t hd data hold time 50 100 100 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 7t r clk rise time ? 2 s( note 1 ) 8t f clk fall time ? 2 s( note 1 ) 9t hi clock high time 150 230 475 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 10 t lo clock low time 150 230 475 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 11 t cld clock delay time 50 ? ns 12 t cle clock enable time 50 ? ns 13 t v output valid from clock low ? ? ? 150 230 475 ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 14 t ho output hold time 0 ? ns ( note 1 ) 15 t dis output disable time ? ? ? 200 250 500 ns ns ns v cc = 4.5v to 5.5v ( note 1 ) v cc = 2.5v to 5.5v ( note 1 ) v cc = 1.8v to 5.5v ( note 1 ) 16 t hs hold setup time 100 100 200 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 17 t hh hold hold time 100 100 200 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 18 t hz hold low to output high-z 100 150 200 ? ? ? ns ns ns v cc = 4.5v to 5.5v ( note 1 ) v cc = 2.5v to 5.5v ( note 1 ) v cc = 1.8v to 5.5v ( note 1 ) 19 t hv hold high to output valid 100 150 200 ? ? ? ns ns ns v cc = 4.5v to 5.5v v cc = 2.5v to 5.5v v cc = 1.8v to 5.5v 20 t wc internal write cycle time ? 5ms 21 ? endurance 100 k ? e/w cycles ( note 3 ) note 1: this parameter is periodically sampled and not 100% tested. 2: f clk max. = 2.5 mhz for t amb > 85 c. 3: this parameter is not tested but established by characterization. for endurance estimates in a specific application, please consult the total endurance model which can be obtained on our website.
? 2001 microchip technology inc. ds21223e-page 5 25aa640/25lc640 figure 1-1: hold timing figure 1-2: serial input timing figure 1-3: serial output timing cs sck so si hold 17 16 16 17 19 18 don ? t care 5 high impedance n+2 n+1 n n-1 n n+2 n+1 n n n-1 cs sck si so 6 5 8 7 11 3 lsb in msb in high impedance 12 mode 1,1 mode 0,0 4 2 cs sck so 10 9 13 msb out lsb out 3 15 don ? t care si mode 1,1 mode 0,0 14
25aa640/25lc640 ds21223e-page 6 ? 2001 microchip technology inc. 1.3 ac test conditions figure 1-4: ac test circuit ac waveform: v lo = 0.2v v hi = v cc - 0.2v ( note 1 ) v hi = 4.0v ( note 2 ) timing measurement reference level input 0.5 v cc output 0.5 v cc note 1: for v cc 4.0v 2: for v cc > 4.0v v cc so 100 pf 1.8 k ? 2.25 k ?
? 2001 microchip technology inc. ds21223e-page 7 25aa640/25lc640 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table 2.1 chip select (cs ) a low level on this pin selects the device. a high level deselects the device and forces it into standby mode. however, a programming cycle which is already initi- ated or in progress will be completed, regardless of the cs input signal. if cs is brought high during a program cycle, the device will go into standby mode when the programming cycle is complete. when the device is deselected, so goes to the high impedance state, allowing multiple parts to share the same spi bus. a low to high transition on cs after a valid write sequence initiates an internal write cycle. after power-up, a high to low transition on cs is required prior to any sequence being initiated. 2.2 serial output (so) the so pin is used to transfer data out of the 25xx640. during a read cycle, data is shifted out on this pin after the falling edge of the serial clock. 2.3 write protect (wp ) this pin is used in conjunction with the wpen bit in the status register to prohibit writes to the non-volatile bits in the status register. when wp is low and wpen is high, writing to the non-volatile bits in the status register is disabled. all other operations function normally. when wp is high, all functions, including writes to the non-volatile bits in the status register operate normally. if the wpen bit is set, wp low during a status register write sequence will disable writing to the status register. if an internal write cycle has already begun, wp going low will have no effect on the write. the wp pin function is blocked when the wpen bit in the status register is low. this allows the user to install the 25aa640/25lc640 in a system with wp pin grounded and still be able to write to the status register. the wp pin functions will be enabled when the wpen bit is set high. 2.4 serial input (si) the si pin is used to transfer data into the device. it receives instructions, addresses, and data. data is latched on the rising edge of the serial clock. 2.5 serial clock (sck) the sck is used to synchronize the communication between a master and the 25xx640. instructions, addresses, or data present on the si pin are latched on the rising edge of the clock input, while data on the so pin is updated after the falling edge of the clock input. 2.6 hold (hold ) the hold pin is used to suspend transmission to the 25xx640 while in the middle of a serial sequence with- out having to re-transmit the entire sequence over again. it must be held high any time this function is not being used. once the device is selected and a serial sequence is underway, the hold pin may be pulled low to pause further serial communication without resetting the serial sequence. the hold pin must be brought low while sck is low, otherwise the hold function will not be invoked until the next sck high to low transition. the 25xx640 must remain selected dur- ing this sequence. the si, sck, and so pins are in a high impedance state during the time the device is paused and transitions on these pins will be ignored. to resume serial communication, hold must be brought high while the sck pin is low, otherwise serial commu- nication will not resume. lowering the hold line at any time will tri-state the so line. name pdip soic tssop description cs 1 1 3 chip select input so 2 2 4 serial data output wp 3 3 5 write protect pin v ss 44 6ground si 5 5 7 serial data input sck 6 6 8 serial clock input hold 7 7 1 hold input v cc 8 8 2 supply voltage
25aa640/25lc640 ds21223e-page 8 ? 2001 microchip technology inc. 3.0 functional description 3.1 principles of operation the 25xx640 is a 8192 byte serial eeprom designed to interface directly with the serial peripheral interface (spi) port of many of today ? s popular microcontroller families, including microchip ? s pic16c6x/7x micro- controllers. it may also interface with microcontrollers that do not have a built-in spi port by using discrete i/o lines programmed properly with the software. the 25xx640 contains an 8-bit instruction register. the device is accessed via the si pin, with data being clocked in on the rising edge of sck. the cs pin must be low and the hold pin must be high for the entire operation. table 3-1 contains a list of the possible instruction bytes and format for device operation. all instructions, addresses, and data are transferred msb first, lsb last. data is sampled on the first rising edge of sck after cs goes low. if the clock line is shared with other periph- eral devices on the spi bus, the user can assert the hold input and place the 25xx640 in ? hold ? mode. after releasing the hold pin, operation will resume from the point when the hold was asserted. 3.2 read sequence the device is selected by pulling cs low. the 8-bit read instruction is transmitted to the 25xx640 followed by the 16-bit address with the three msb ? s of the address being don ? t care bits. after the correct read instruction and address are sent, the data stored in the memory at the selected address is shifted out on the so pin. the data stored in the memory at the next address can be read sequentially by continuing to provide clock pulses. the internal address pointer is automatically incre- mented to the next higher address after each byte of data is shifted out. when the highest address is reached (1fffh), the address counter rolls over to address 0000h allowing the read cycle to be continued indefinitely. the read operation is terminated by raising the cs pin (figure 3-1). 3.3 write sequence prior to any attempt to write data to the 25xx640 array or status register, the write enable latch must be set by issuing the wren instruction (figure 3-4). this is done by setting cs low and then clocking out the proper instruction into the 25xx640. after all eight bits of the instruction are transmitted, the cs must be brought high to set the write enable latch. if the write operation is initiated immediately after the wren instruction without cs being brought high, the data will not be writ- ten to the array because the write enable latch will not have been properly set. once the write enable latch is set, the user may pro- ceed by setting the cs low, issuing a write instruction, followed by the address, and then the data to be writ- ten. up to 32 bytes of data can be sent to the 25xx640 before a write cycle is necessary. the only restriction is that all of the bytes must reside in the same page. a page address begins with xxx0 0000 and ends with xxx1 1111 . if the internal address counter reaches xxx1 1111 and the clock continues, the counter will roll back to the first address of the page and overwrite any data in the page that may have been written. for the data to be actually written to the array, the cs must be brought high after the least significant bit (d0) of the n th data byte has been clocked in. if cs is brought high at any other time, the write operation will not be completed. refer to figure 3-2 and figure 3-3 for more detailed illustrations on the byte write sequence and the page write sequence respectively. while the write is in progress, the status register may be read to check the status of the wpen, wip, wel, bp1, and bp0 bits (figure 3-6). a read attempt of a memory array location will not be possible during a write cycle. when the write cycle is completed, the write enable latch is reset. table 3-1: instruction set instruction name instruction format description read 0000 0011 read data from memory array beginning at selected address write 0000 0010 write data to memory array beginning at selected address wren 0000 0110 set the write enable latch (enable write operations) wrdi 0000 0100 reset the write enable latch (disable write operations) rdsr 0000 0101 read status register wrsr 0000 0001 write status register
? 2001 microchip technology inc. ds21223e-page 9 25aa640/25lc640 figure 3-1: read sequence figure 3-2: byte write sequence figure 3-3: page write sequence so si sck cs 0 234567891011 21222324252627282930 31 1 01 0 0 0 0 0 1 15 14 13 12 210 76543210 instruction 16 bit address data out high impedance so si cs 00 0 0 0 0 0 1 15 14 13 12 210 76543210 instruction 16 bit address data byte high impedance twc si cs 9 1011 21222324252627282930 31 00 0 0 0 0 0 1 15 14 13 12 210 76543210 instruction 16 bit address data byte 1 sck 0 234567 1 8 si cs 41 42 43 46 47 76543210 data byte n (32 max) sck 32 34 35 36 37 38 39 33 40 76543210 data byte 3 76543210 data byte 2 44 45
25aa640/25lc640 ds21223e-page 10 ? 2001 microchip technology inc. 3.4 write enable (wren) and write disable (wrdi) the 25xx640 contains a write enable latch. see table 3-3 for the write protect functionality matrix. this latch must be set before any write operation will be completed internally. the wren instruction will set the latch, and the wrdi will reset the latch. the following is a list of conditions under which the write enable latch will be reset: power-up wrdi instruction successfully executed wrsr instruction successfully executed write instruction successfully executed figure 3-4: write enable sequence figure 3-5: write disable sequence sck 0 234567 1 si high impedance so cs 01 0000 0 1 sck 0 234567 1 si high impedance so cs 01 0000 0 1 0
? 2001 microchip technology inc. ds21223e-page 11 25aa640/25lc640 3.5 read status register (rdsr) the read status register (rdsr) instruction provides access to the status register. the status register may be read at any time, even during a write cycle. the sta- tus register is formatted as follows: the write-in-process (wip) bit indicates whether the 25xx640 is busy with a write operation. when set to a ? 1 ? , a write is in progress, when set to a ? 0 ? , no write is in progress. this bit is read only. the write enable latch (wel) bit indicates the status of the write enable latch. when set to a ? 1 ? , the latch allows writes to the array and status register, when set to a ? 0 ? , the latch prohibits writes to the array and status register. the state of this bit can always be updated via the wren or wrdi commands regardless of the state of write protection on the status register. this bit is read only. the block protection (bp0 and bp1) bits indicate which blocks are currently write protected. these bits are set by the user issuing the wrsr instruction. these bits are non-volatile. see figure 3-6 for rdsr timing sequence. figure 3-6: read status register timing sequence 7 654 3 2 1 0 wpen x x x bp1 bp0 wel wip so si cs 91011 12131415 11 0 0 0 0 00 7654 2 10 instruction data from status register high impedance sck 0 234567 18 3
25aa640/25lc640 ds21223e-page 12 ? 2001 microchip technology inc. 3.6 write status register (wrsr) the write status register (wrsr) instruction allows the user to select one of four levels of protection for the array by writing to the appropriate bits in the status reg- ister. the array is divided up into four segments. the user has the ability to write protect none, one, two, or all four of the segments of the array. the partitioning is controlled as shown in table 3-2. the write protect enable (wpen) bit is a non-volatile bit that is available as an enable bit for the wp pin. the write protect (wp ) pin and the write protect enable (wpen) bit in the status register control the program- mable hardware write protect feature. hardware write protection is enabled when wp pin is low and the wpen bit is high. hardware write protection is disabled when either the wp pin is high or the wpen bit is low. when the chip is hardware write protected, only writes to non-volatile bits in the status register are disabled. see table 3-3 for a matrix of functionality on the wpen bit. see figure 3-7 for wrsr timing sequence. table 3-2: array protection figure 3-7: write status register timing sequence bp1 bp0 array addresses write protected 0 0 none 0 1 upper 1/4 (1800h - 1fffh) 1 0 upper 1/2 (1000h - 1fffh) 11 all (0000h - 1fffh) so si cs 91011 12131415 01 0 0 0 0 00 7654 210 instruction data to status register high impedance sck 0 234567 18 3
? 2001 microchip technology inc. ds21223e-page 13 25aa640/25lc640 3.7 data protection the following protection has been implemented to pre- vent inadvertent writes to the array: the write enable latch is reset on power-up a write enable instruction must be issued to set the write enable latch after a byte write, page write, or status register write, the write enable latch is reset cs must be set high after the proper number of clock cycles to start an internal write cycle access to the array during an internal write cycle is ignored and programming is continued 3.8 power-on-state the 25xx640 powers on in the following state: the device is in low power standby mode (cs =1) the write enable latch is reset so is in high impedance state a high to low transition on cs is required to enter the active state . table 3-3: write protect functionality matrix wpen wp wel protected blocks unprotected blocks status register x x 0 protected protected protected 0 x 1 protected writable writable 1 low 1 protected writable protected x high 1 protected writable writable
25aa640/25lc640 ds21223e-page 14 ? 2001 microchip technology inc. 4.0 packaging information 4.1 package marking information legend: xx...x customer specific information* yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ? 01 ? ) nnn alphanumeric traceability code note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * standard marking consists of microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). for marking beyond this, certain price adders apply. please check with your microchip sales office. xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn 25lc640 /pnnn yyww 25lc640 i/snyyww nnn 8-lead tssop example: xxxx yyww nnn 5lcx iyww nnn
? 2001 microchip technology inc. ds21223e-page 15 25aa640/25lc640 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p e eb c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top 51015 51015 mold draft angle bottom 51015 51015 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010 ? (0.254mm) per side. significant characteristic
25aa640/25lc640 ds21223e-page 16 ? 2001 microchip technology inc. 8-lead plastic small outline (sn) ? narrow, 150 mil (soic) foot angle f 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l c 45 f a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010 ? (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic
? 2001 microchip technology inc. ds21223e-page 17 25aa640/25lc640 8-lead plastic thin shrink small outline (st) ? 4.4 mm (tssop) 10 5 0 10 5 0 mold draft angle bottom 10 5 0 10 5 0 mold draft angle top 0.30 0.25 0.19 .012 .010 .007 b lead width 0.20 0.15 0.09 .008 .006 .004 c lead thickness 0.70 0.60 0.50 .028 .024 .020 l foot length 3.10 3.00 2.90 .122 .118 .114 d molded package length 4.50 4.40 4.30 .177 .173 .169 e1 molded package width 6.50 6.38 6.25 .256 .251 .246 e overall width 0.15 0.10 0.05 .006 .004 .002 a1 standoff 0.95 0.90 0.85 .037 .035 .033 a2 molded package thickness 1.10 .043 a overall height 0.65 .026 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters* inches units a2 a a1 l c f 1 2 d n p b e e1 foot angle f 048048 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .005 ? (0.127mm) per side. jedec equivalent: mo-153 drawing no. c04-086 significant characteristic
25aa640/25lc640 ds21223e-page 18 ? 2001 microchip technology inc. notes:
? 2001 microchip technology inc. ds21223e-page 19 25aa640/25lc640 systems information and upgrade hot line the systems information and upgrade line provides system users a listing of the latest versions of all of microchip ? s development systems software products. plus, this line provides information on how customers can receive any currently available upgrade kits.the hot line numbers are: 1-800-755-2345 for u.s. and most of canada, and 1-480-792-7302 for the rest of the world. on-line support microchip provides on-line support on the microchip world wide web (www) site. the web site is used by microchip as a means to make files and information easily available to customers. to view the site, the user must have access to the internet and a web browser, such as netscape or microsoft explorer. files are also available for ftp download from our ftp site. connecting to the microchip internet web site the microchip web site is available by using your favorite internet browser to attach to: www.microchip.com the file transfer site is available by using an ftp ser- vice to connect to: ftp://ftp.microchip.com the web site and file transfer site provide a variety of services. users may download files for the latest development tools, data sheets, application notes, user ? s guides, articles and sample programs. a vari- ety of microchip specific business information is also available, including listings of microchip sales offices, distributors and factory representatives. other data available for consideration is: latest microchip press releases technical support section with frequently asked questions design tips device errata job postings microchip consultant program member listing links to other useful web sites related to microchip products conferences for products, development systems, technical information and more listing of seminars and events 013001
25aa640/25lc640 ds21223e-page 20 ? 2001 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip prod- uct. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this data sheet. 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this data sheet easy to follow? if not, why? 4. what additions to the data sheet do you think would enhance the structure and subject? 5. what deletions from the data sheet could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document? 8. how would you improve our software, systems, and silicon products? to : technical publications manager re: reader response total pages sent from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds21223e 25aa640/25lc640
? 2001 microchip technology inc. ds21223e-page 21 25aa040/25lc040 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . sales and support part no. x /xx package temperature range device device 25aa640: 64k bit 1.8v spi serial eeprom 25aa640t: 64k bit 1.8v spi serial eeprom (tape and reel) 25aa640x: 64k bit 1.8v spi serial eeprom in alternate pinout (st only) 25aa640xt: 64k bit 1.8v spi serial eeprom in alternate pinout tape and reel (st only) 25lc640: 64k bit 2.5v spi serial eeprom 25lc640t: 64k bit 2.5v spi serial eeprom (tape and reel) 25lc640x: 64k bit 2.5v spi serial eeprom in alternate pinout (st only) 25lc640xt: 64k bit 2.5v spi serial eeprom in alternate pinout tape and reel (st only) temperature range i = -40 c to +85 c e= -40 c to +125 c package p = plastic dip (300 mil body), 8-lead sn = plastic soic (150 mil body), 8-lead st = plastic tssop (4.4 mm body), 8-lead examples: a) 25aa640-i/sn: industrial temp., soic package b) 25aa640t-i/sn: tape and reel, industrial temp., soic package c) 25aa640-i/st: industrial temp., tssop package a) 25lc640-i/sn: industrial temp., soic package b) 25lc640t-i/sn: tape and reel, industrial temp., soic package c) 25lc640x-i/st: alternate pinout, industrial temp., tssop package data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
25aa040/25lc040 ds21223e-page 22 ? 2001 microchip technology inc. notes:
? 2001 microchip technology inc. ds21223e-page 23 25aa040/25lc040 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warranty is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microchip ? s products as critical com- ponents in life support systems is not authorized except with express written approval by microchip. no licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo, pic, picmicro, picmaster, picstart, pro mate, k ee l oq , seeval, mplab and the embedded control solutions company are reg- istered trademarks of microchip technology incorporated in the u.s.a. and other countries. total endurance, icsp, in-circuit serial programming, filter- lab, mxdev, microid, flex rom, fuzzy lab, mpasm, mplink, mplib, picc, picdem, picdem.net, icepic, migratable memory, fansense, economonitor, select mode and microport are trademarks of microchip technology incorporated in the u.s.a. serialized quick term programming (sqtp) is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2001, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. microchip received qs-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona in july 1999. the company?s quality system processes and procedures are qs-9000 compliant for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms and microperipheral products. in addition, microchip ? s quality system for the design and manufacture of development systems is iso 9001 certified.
ds21223e-page 24 ? 2001 microchip technology inc. m americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: 480-792-7627 web address: http://www.microchip.com rocky mountain 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7966 fax: 480-792-7456 atlanta 500 sugar mill road, suite 200b atlanta, ga 30350 tel: 770-640-0034 fax: 770-640-0307 austin - analog 13740 north highway 183 building j, suite 4 austin, tx 78750 tel: 512-257-3370 fax: 512-257-8526 boston 2 lan drive, suite 120 westford, ma 01886 tel: 978-692-3848 fax: 978-692-3821 boston - analog unit a-8-1 millbrook tarry condominium 97 lowell road concord, ma 01742 tel: 978-371-6400 fax: 978-371-0050 chicago 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 dayton two prestige place, suite 130 miamisburg, oh 45342 tel: 937-291-1654 fax: 937-291-9175 detroit tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 los angeles 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 new york 150 motor parkway, suite 202 hauppauge, ny 11788 tel: 631-273-5305 fax: 631-273-5335 san jose microchip technology inc. 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 toronto 6285 northam drive, suite 108 mississauga, ontario l4v 1x5, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia microchip technology australia pty ltd suite 22, 41 rawson street epping 2121, nsw australia tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing microchip technology consulting (shanghai) co., ltd., beijing liaison office unit 915 bei hai wan tai bldg. no. 6 chaoyangmen beidajie beijing, 100027, no. china tel: 86-10-85282100 fax: 86-10-85282104 china - chengdu microchip technology consulting (shanghai) co., ltd., chengdu liaison office rm. 2401, 24th floor, ming xing financial tower no. 88 tidu street chengdu 610016, china tel: 86-28-6766200 fax: 86-28-6766599 china - fuzhou microchip technology consulting (shanghai) co., ltd., fuzhou liaison office rm. 531, north building fujian foreign trade center hotel 73 wusi road fuzhou 350001, china tel: 86-591-7557563 fax: 86-591-7557572 china - shanghai microchip technology consulting (shanghai) co., ltd. room 701, bldg. b far east international plaza no. 317 xian xia road shanghai, 200051 tel: 86-21-6275-5700 fax: 86-21-6275-5060 china - shenzhen microchip technology consulting (shanghai) co., ltd., shenzhen liaison office rm. 1315, 13/f, shenzhen kerry centre, renminnan lu shenzhen 518001, china tel: 86-755-2350361 fax: 86-755-2366086 hong kong microchip technology hongkong ltd. unit 901-6, tower 2, metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2401-1200 fax: 852-2401-3431 india microchip technology inc. india liaison office divyasree chambers 1 floor, wing a (a3/a4) no. 11, o ? shaugnessey road bangalore, 560 025, india tel: 91-80-2290061 fax: 91-80-2290062 japan microchip technology japan k.k. benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea microchip technology korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea 135-882 tel: 82-2-554-7200 fax: 82-2-558-5934 singapore microchip technology singapore pte ltd. 200 middle road #07-02 prime centre singapore, 188980 tel: 65-334-8870 fax: 65-334-8850 taiwan microchip technology taiwan 11f-3, no. 207 tung hua north road taipei, 105, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe denmark microchip technology denmark aps regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45 4420 9895 fax: 45 4420 9910 france arizona microchip technology sarl parc d ? activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany arizona microchip technology gmbh gustav-heinemann ring 125 d-81739 munich, germany tel: 49-89-627-144 0 fax: 49-89-627-144-44 germany - analog lochhamer strasse 13 d-82152 martinsried, germany tel: 49-89-895650-0 fax: 49-89-895650-22 italy arizona microchip technology srl centro direzionale colleoni palazzo taurus 1 v. le colleoni 1 20041 agrate brianza milan, italy tel: 39-039-65791-1 fax: 39-039-6899883 united kingdom arizona microchip technology ltd. 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44 118 921 5869 fax: 44-118 921-5820 08/01/01 w orldwide s ales and s ervice

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